Ultraviolet laser marking machine is a laser engraving system with 355nm ultraviolet laser wavelength for cold laser engraving projects, due to high repetition rate, it is especially suitable for etching plastics (ABS, PA, PE, PP, PS, PC, PLA, PVC , POM, PMMA), silicon, ceramics, glass, wood, metal and paper.
Equipment Introduction
Ultraviolet laser marking machine is a laser engraving system with 355nm ultraviolet laser wavelength for cold laser engraving projects, due to high repetition rate, it is especially suitable for etching plastics (ABS, PA, PE, PP, PS, PC, PLA, PVC , POM, PMMA), silicon, ceramics, glass, wood, metal and paper.
Features
Ultraviolet laser marking machine has the characteristics of high performance and ultra-fine.
The effect is fine, the marking is clear and firm, and it is better than non-polluting ink printing.
The focusing spot is small, the action time of the narrow pulse width laser on the processing material is short, and the processing thermal effect is small.
The equipment can run stably for a long time on the production line with complex working conditions, meet the marking requirements of various materials, and the marking is permanent and eye-catching
Application
Suitable for high-precision marking of precision electronic components, plastics, leather, woodworking projects.
It is suitable for ultra-fine marking on the surface of packaging bottles of cosmetic, pharmaceutical, food and other polymer materials.
Marking of sapphire, polymer films, etc.
Marking and cutting of flexible PCB boards, microvia and blind via processing of silicon wafers.
Parameter
Marking range: 110mmx110mm-300mmx300mm (optional)
Marking method: plane or 3D engraving
Laser wavelength: 355nm
Output power: 3-20 watts
Cooling method: water cooling or air cooling
Minimum line width: ≤0.005mm
Galvanometer scanning speed: 0-12000mm/S
Repeat accuracy: 0.01mm
Response time: 0.2ms
Pulse width: <25ns
Pulse frequency: 20-200KHZ
Beam quality: m²<1.2
Power demand: 110v-220v/50HZ/60HZ single phase
Application Display